Thermal design product
Heat transfer pad
Heat transfer pad
CHANGE GEL CGDR
Non-silicone
CGDR CGDR CHANGE GEL
Feature
Thermal interface material for use between
heating elements and heat sinks
Low thermal resistance
Easy and clean handling
- Solid at room temperature and no need for measurement like grease
- Non-Silicon
- Single-sided no adhesive
- Phase change
- Thin type
Materials
EPDM
Specification
List
| Material | Non-Silicon | Feature | Single-sided no adhesive, Phase change, Thin type |
|---|---|---|---|
| Color | Gray | Specific gravity | - |
| Volume resistivity(Ω・cm) | 1.0×10[[sup:14]] | Adhesive strenght(N / 25mm) | - |
| Hardness(ASKER C) | - | Hardness(Shore A) | - |
| Phase change temperature(°C) | 50 | Thermal conductivity(W / m・K) | 2.0 |
| Permeability(μ') | - | Standard length(mm) | 205×205 |
Product Dimensions
Part No. list
You can download a drawing and a test report,
add an sample to Sample Request Box per part number.
| Part No. | Thickness(mm) | L1(mm) | L2(mm) | Flame retardance(UL) | Download Data | Sample Request |
|---|---|---|---|---|---|---|
| CGDR-0.15 | 0.15 | 205 | 205 | - | ||
| CGDR-0.25 | 0.25 | 205 | 205 | - | ||
| CGDR-0.5 | 0.5 | 205 | 205 | - |
Product Inquiry
Please send us your inquiry from the query system regarding product and technical matter about it.
Suggestion of selection guide of expected Thermal Interface Product is also available.
If you are a website member, you can easily ask inquiry after Login.
入力フォーム読み込み中...フォームが表示されない場合