Thermal Management Materials
Thermal pads
Silicone-free type
COOLPROVIDE™（Both side tacky） CPSH
Thermal conductivity 5W/m・K, low-hardness (ASKER C 32) thermal pad
COOLPROVIDE™（One side tacky） CPSH-F
Thermal conductivity 5W/m・K, low-hardness (ASKER C 32) thermal pad
COOLPROVIDE™（Both side tacky） CPVH
Thermal conductivity 3W/m・K, low-hardness (ASKER C 15) thermal pad
HEAT SPREADER SHEET HSD
Thin and flexible heat spreader for thermal management at hot spots in devices
COOLPROVIDE™（One side tacky） CPVH-F
Thermal conductivity 3W/m・K, low-hardness (ASKER C 15) thermal pad
COOLPROVIDE™（One side tacky） CPVP-30-F
Silicone-free, low-hardness, high thermal conductivity (3W/m・K) thermal pad
THERMAL DAMPER（One side adhesive attached） CPAG-T
Thermal pad with vibration damping of loss factor 0.9
CHANGE GEL™（Both side tacky） CGD
Phase changeable thermal pad which softens and increases in adhesive strength at 50℃
CHANGE GEL™（One side tacky） CGDR
Phase changeable thermal pad which softens and increases in adhesive strength at 50℃
