Thermal design product

Heat transfer pad

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Heat transfer pad



Thermal pad with conductivity 3W/m・K, suitable for electronic devices


Flexible and highly thermally conductive
Contact failures of PCBs etc. rarely occur after long-term use since the pad outgasses very small amount of molecular siloxane only little.
Operating temperature range is from -20℃ to 125℃.
Suitable for managing heat issues of electronics.

Compliant with RoHS Directive 2011/65/EU

  • Thermal pad
  • Silicone
  • High thermal conductivity
  • Natural tack on both sides
  • UL rated available





Material Silicone Feature High thermal conductivity, Natural tack on both sides, UL rated available
Color Green Specific gravity -
Volume resistivity(Ω・cm) 2.0×10[[sup:11]] Adhesive strenght(N / 25mm) -
Hardness(ASKER C) 40 Hardness(Shore A) -
Phase change temperature(°C) - Thermal conductivity(W / m・K) 3.0
Permeability(μ') - Standard length(mm) 210×510

Product Dimensions


Part No. list

You can download a drawing and a test report,
add an sample to Sample Request Box per part number.

Part No. Thickness(mm) L1(mm) L2(mm) Flame retardance(UL) Download Data Sample Request
SPVS-0.5 0.5 210 510 94 V-0
SPVS-1.0 1.0 210 510 94 V-0

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