Thermal design product
Heat transfer pad
Heat transfer pad
COOLPROVIDE CPVP-F
Non-silicone
Ultra soft (ASKER C 0) Thermal Pad
Feature
Super compliable (ASKER C 0) material minimizes thermal resistance.
Compliable thermal pad with excellent compressive stress relaxation that reduces the load to heat element and PCB.
Layered design for easy handling.
Silicone-free, no siloxane outgassing.
Oil bleeding is reduced compared to silicone-based thermal materials.
Complied with RoHS Directive 2011/65/EU
- Non-Silicon
- High thermal conductivity
- High flexibility
- Single-sided adhesive
- Available for UL
Materials
Acrylic
Specification
List
| Material | Non-Silicon | Feature | High flexibility, Single-sided adhesive, Available for UL |
|---|---|---|---|
| Color | Dark Green | Specific gravity | - |
| Volume resistivity(Ω・cm) | 1.0×10[[sup:11]] | Adhesive strenght(N / 25mm) | - |
| Hardness(ASKER C) | 0 | Hardness(Shore A) | - |
| Phase change temperature(°C) | - | Thermal conductivity(W / m・K) | 2.0 |
| Permeability(μ') | - | Standard length(mm) | - |
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