Thermal Management Materials
Thermal pads
Thermal pads
COOLPROVIDE™(One side tacky) CPVP-30-F
Feature
Super compliable (ASKER C 0) material minimizes thermal resistance.
Compliable thermal pad with excellent compressive stress relaxation that reduces the load to heat element and PCB.
* 1.0, 1.5 and 2.0mm thick products are under development.
Layered design for easy handling.
Silicone-free, no siloxane outgassing.
Oil bleeding is reduced compared to silicone-based thermal materials.
- Silicone-free
- High thermal conductivity
- High flexibility
- One side tacky
Materials
Specification
List
Material | Silicone-free | Feature | Silicone-free, High thermal conductivity, High flexibility, One side tacky |
---|---|---|---|
Color | Green/White | Specific gravity | - |
Volume resistivity(Ω・cm) | 1.0×10[[sup:11]] | Tracking resistance test CTI(V) | - |
Hardness(ASKER C) | 7.0 | Hardness(Shore OO) | 18 |
Hardness(Shore A) | - | Thermal conductivity(Hot wire method)(W / m・K) | 3.0 |
Thermal conductivity(Hot Disk method)(W / m・K) | 3.0 | Phase change temperature(℃) | - |
Permeability(μ') | - | Maximum effective dimensions(mm) | 200×500 |
Different part number may have different characteristics. Please refer to the catalog for details.
Please refer to the catalog for thermal conductivity standards.
The thermal pad can be layered to make it thicker.
Product Dimensions
Part No. list
You can download a drawing and a test report,
add an sample to Sample Request Box per part number.
Part No. | Thickness(mm) | L1(mm) | L2(mm) | Flame retardance(UL) | Download Data | Sample Request |
---|---|---|---|---|---|---|
CPVP-30-1.0F | 1.0 | - | - | ― | Please ask | |
CPVP-30-1.5F | 1.5 | - | - | ― | Please ask | |
CPVP-30-2.0F | 2.0 | - | - | ― | Please ask | |
CPVP-30-3.0F | 3.0 | - | - | 94 V-0相当 | Please ask | |
CPVP-30-4.0F | 4.0 | - | - | 94 V-0相当 | Please ask |
Product Inquiry
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