Thermal design product

Heat transfer pad

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Heat transfer pad



A non-silicon sheet with high thermal conductivity of super low hardness.


Super low hardness (ASKER C 15) and high thermal conductivity
(3W/m・K) are realized as a non-silicon thermally conductivity sheet.
Because of excellent contact property, contact resistance
can be reduced.
Because of a non-silicon material, siloxane is not contained.
Because of excellent flexibility and stress relaxation property,
loads to devices and printed circuit boards can be reduced
after assembling.
Recommended operating temperature range is -40℃~125℃.
Oil bleed is less, compared with silicone type.

Complied with RoHS Directive 2011/65/EU

  • Non-Silicon
  • High thermal conductivity
  • High flexibility
  • Double-sided tack
  • Available for UL





Material Non-Silicon Feature High thermal conductivity, High flexibility, Double-sided tack, Available for UL
Color Brown Specific gravity -
Volume resistivity(Ω・cm) 1.0×10[[sup:11]] Adhesive strenght(N / 25mm) -
Hardness(ASKER C) 15 Hardness(Shore A) -
Phase change temperature(°C) - Thermal conductivity(W / m・K) 3.0
Permeability(μ') - Standard length(mm) 210×510

Product Dimensions


Part No. list

You can download a drawing and a test report,
add an sample to Sample Request Box per part number.

Part No. Thickness(mm) L1(mm) L2(mm) Flame retardance(UL) Download Data Sample Request
CPVH-2.0 2.0 210 510 94 V-0
CPVH-3.0 3.0 210 510 94 V-0
CPVH-4.0 4.0 210 510 94 V-0

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