Thermal design product
Heat transfer pad
Heat transfer pad
COOLPROVIDE™ CPVG
Putty TIM can be applied thickly with a dispenser
Feature
Putty TIM does not drip even when coated thickly.
Useful to fill gaps between heat spreaders and ICs of various heights.
Putty type TIM has low repulsive force (after compression),
load on ICs and PCBs is lowered to 10 % or less of the sheet type.
Single liquid type, cross-linked material does not easily drip.
Auto coating is possible with a dispenser.
Silicone-free type generates no siloxane gas and oil bleeding is reduced.
- Non-Silicon
- High flexibility
- High thermal conductivity
- Thin type
Specification
List
| Material | Non-Silicon | Feature | High flexibility, High thermal conductivity, Thin type |
|---|---|---|---|
| Color | Gray | Specific gravity | 2.9 |
| Volume resistivity(Ω・cm) | 1.0×10[[sup:9]] | Adhesive strenght(N / 25mm) | - |
| Hardness(ASKER C) | - | Hardness(Shore A) | - |
| Phase change temperature(°C) | - | Thermal conductivity(W / m・K) | 3.0 |
| Permeability(μ') | - | Standard length(mm) | Cartridge：330ml |
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