Thermal Management Materials
Thermal pads
Thermal pads
COOLPROVIDE™ CPVG
Feature
Putty TIM does not drip even when coated thickly.
Useful to fill gaps between heat spreaders and ICs of various heights
Putty type TIM has low repulsive force (after compression) and load on ICs and PCBs is lowered to 10 % or less compared to the sheet type.
Single liquid type, cross-linked material scarcely drips.
Auto coating is possible with a dispenser.
Silicone free material generates no siloxane outgassing and hardly bleeds oil.
- Silicone-free
- Highly flexible
- High thermal conductivity
- Thin type
Specification
List
| Material | Silicone-free | Feature | High flexibility, High thermal conductivity, Thin type |
|---|---|---|---|
| Color | Gray | Specific gravity | 2.9 |
| Volume resistivity(Ω・cm) | 1.0×10[[sup:9]] | Tracking resistance test CTI(V) | - |
| Hardness(ASKER C) | - | Hardness(Shore OO) | - |
| Hardness(Shore A) | - | Thermal conductivity(Hot wire method)(W / m・K) | 3.0 |
| Thermal conductivity(Hot Disk method)(W / m・K) | 3.0 | Phase change temperature(℃) | - |
| Permeability(μ') | - | Maximum effective dimensions(mm) | Cartridge:330ml |
Different part number may have different characteristics. Please refer to the catalog for details.
Please refer to the catalog for thermal conductivity standards.
The thermal pad can be layered to make it thicker.
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