Thermal design product

Heat transfer pad

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Heat transfer pad

COOLPROVIDE™ CPVG

Non-silicone

Putty TIM can be applied thickly with a dispenser

Feature

Putty TIM does not drip even when coated thickly.
Useful to fill gaps between heat spreaders and ICs of various heights.
Putty type TIM has low repulsive force (after compression),
load on ICs and PCBs is lowered to 10 % or less of the sheet type.
Single liquid type, cross-linked material does not easily drip.
Auto coating is possible with a dispenser.
Silicone-free type generates no siloxane gas and oil bleeding is reduced.

  • Non-Silicon
  • High flexibility
  • High thermal conductivity
  • Thin type

Specification

List

Material Non-Silicon Feature High flexibility, High thermal conductivity, Thin type
Color Gray Specific gravity 2.9
Volume resistivity(Ω・cm) 1.0×10[[sup:9]] Adhesive strenght(N / 25mm) -
Hardness(ASKER C) - Hardness(Shore A) -
Phase change temperature(°C) - Thermal conductivity(W / m・K) 3.0
Permeability(μ') - Standard length(mm) Cartridge:330ml

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