Thermal design product
Heat transfer pad
Heat transfer pad
COOLPROVIDE CPSH-F
Non-silicone
5W/m・K silicone thermal pad (ASKER C 32) for high operating temperature applications
Feature
Super compliable (ASKER C 32) material minimizes thermal resistance.
Silicone-free, no siloxane outgassing.
Oil bleeding is reduced compared to silicone-based thermal materials.
- Non-Silicon
- High flexibility
- Single-sided no adhesive
- Available for UL
Specification
List
| Material | Non-Silicon | Feature | High flexibility, Single-sided no adhesive, Available for UL |
|---|---|---|---|
| Color | Light green | Specific gravity | - |
| Volume resistivity(Ω・cm) | 1.0×10[[sup:11]] | Adhesive strenght(N / 25mm) | - |
| Hardness(ASKER C) | 32 | Hardness(Shore A) | - |
| Phase change temperature(°C) | - | Thermal conductivity(W / m・K) | 5.0 |
| Permeability(μ') | - | Standard length(mm) | 210×510 |
Product Dimensions
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