Thermal design product
Heat transfer pad
Heat transfer pad
THERMAL DAMPER CPAG-T
Non-silicone
Thermal conductive and vibration damping material
Feature
Dual function thermal conductive and vibration damping.
Excellent vibration control. (loss factor 0.9)
Custom profiles can be provided upon request.
Silicone-free, no siloxane outgassing.
- Non-Silicon
- High thermal conductivity
- Single-sided no adhesive
- Thin type
- vibration damping
Materials
acrylic
Specification
List
| Material | Non-silicon | Feature | High thermal conductivity, Vibration damping |
|---|---|---|---|
| Color | Gray | Specific gravity | - |
| Volume resistivity(Ω・cm) | 5.5×10[[sup:11]] | Adhesive strenght(N / 25mm) | - |
| Hardness(ASKER C) | 70 | Hardness(Shore A) | - |
| Phase change temperature(°C) | - | Thermal conductivity(W / m・K) | 0.8 |
| Permeability(μ') | - | Standard length(mm) | 355×355 |
Product Dimensions
Part No. list
You can download a drawing and a test report,
add an sample to Sample Request Box per part number.
| Part No. | Thickness(mm) | L1(mm) | L2(mm) | Flame retardance(UL) | Download Data | Sample Request |
|---|---|---|---|---|---|---|
| CPAG-2.0 T | 2.0 | 340 | 340 | - | ||
| CPAG-3.0 T | 3.0 | 340 | 340 | - | ||
| CPAG-4.0 T | 4.0 | 340 | 340 | - |
Product Inquiry
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