Thermal design product
Heat transfer pad
Heat transfer pad
CHANGE GEL CGD
Non-silicone
CGD CGDR CHANGE GEL
Feature
Thermal interface material for use between
heating elements and heat sinks
Low thermal resistance
Easy and clean handling
- Solid at room temperature and no need for measurement like grease
- Non-Silicon
- Phase change
- Double-sided tack
- Thin type
Materials
EPDM
Specification
List
| Material | Non-Silicon | Feature | Phase change, Double-sided tack, Thin type |
|---|---|---|---|
| Color | Gray | Specific gravity | - |
| Volume resistivity(Ω・cm) | 1.0×10[[sup:14]] | Adhesive strenght(N / 25mm) | - |
| Hardness(ASKER C) | - | Hardness(Shore A) | - |
| Phase change temperature(°C) | 50 | Thermal conductivity(W / m・K) | 2.0 |
| Permeability(μ') | - | Standard length(mm) | 205×205 |
Product Dimensions
Part No. list
You can download a drawing and a test report,
add an sample to Sample Request Box per part number.
| Part No. | Thickness(mm) | L1(mm) | L2(mm) | Flame retardance(UL) | Download Data | Sample Request |
|---|---|---|---|---|---|---|
| CGD-0.25 | 0.25 | 205 | 205 | - | ||
| CGD-0.5 | 0.5 | 205 | 205 | - |
Product Inquiry
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